| Item |
TSMT Capability |
| SMT ( pick & place) |
Mounting Accuracy : +/-0.05mm (CM602), +/-0.04mm (NPM) |
| Chip Component |
Min : 0201 / 01005 |
| IC (BGA/aQFN) |
Min : Pitch 0.30mm, ɸ0.20mm, >1000 balls (BGA) |
| LED |
Min : 0.25t (Top View), 0.3t (Side View), mini LED size : 5x9mil (sample) |
| LED bar related spec. |
Co-linearity : +/- 0.1mm, Angle Tilt : +/-3°, Angle Rotation : +/-2° |
| Lens |
Lens center to LED center shift : +/- 0.075mm |
| PCB |
Max length : 1200mm, Max width : 460mm / experience layer : 16L |
| Glue Dispensing |
Dispensing Accuracy: +/-0.02mm |
| Special Process |
Hot Bar bonding, ACF bonding, COF puncher, Potting Process,Aging Room. Laser printing,
die-bonding, wire-bonding, IEC17025 Lab (CNAS Lab) |
| Carrier Types |
Regular-type (T ≥ 0.8mm), Spring-type (0.8mm > T > 0.4mm), Magnetic-type (T ≤ 0.4mm)
with metal film (min thickness = 0.05mm) |
